nanog mailing list archives

RE: Patch panel solutions for 4x10GE breakout


From: "Jameson, Daniel" <Daniel.Jameson () tdstelecom com>
Date: Thu, 5 May 2016 15:17:31 +0000

Might be worth having a look at the Corning centrix modules.  Very high densities. 72 terminations  per u. Front side 
mpo/mtp connections.  Have some great slack storage and management options.

________________________________
From: NANOG on behalf of Phil Bedard
Sent: Thursday, May 05, 2016 9:28:55 AM
To: nanog () nanog org
Subject: Patch panel solutions for 4x10GE breakout

So the newer equipment we are looking at uses QSFP+/MTP with 4x10GE breakouts to deliver 10G.  We are not wiring these 
up to things in the same rack, they will be going to patch panels and then elsewhere in a facility.  It could 
potentially get messy with the panels we have today so we are looking at other solutions.  These are all SM LR 
connections using LC.  There are a lot of SM MTP to LC options since that’s the way most panels are wired, but they 
typically have 6 duplex LC connectors per MTP and not 4 which isn’t very efficient in this use case.  I’ve seen others 
just use an intermediate LC to LC panel and just wire the breakouts to those and then jumper the other side elsewhere.

Anything else others have used?  The point of the solution is to keep the wiring mess in front of or near the device to 
a minimum.

Thanks,

Phil



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